LIPS Corporation, a leader in Spatial Intelligence and Machine Vision, has integrated onsemi’s Hyperlux ID iTOF smart sensor into its product line as the LIPSedge™ T235 series. This next-generation Time-of-Flight (ToF) 3D depth camera offers HD resolution and exceptional performance.
The LIPSedge™ T235 enhances the user experience with impressive technical features, including 1.2 megapixels of resolution at 60 frames per second, a wide depth range, low-noise global shutter with BSI (Back-Side Illuminated) pixels for fast-moving object detection, and versatile capabilities for both short and long-range depth sensing.
The onsemi Hyperlux ID is an Indirect Time-of-Flight (iToF) sensor in a 1/3.2-inch optical format. Its depth processing ASIC, stacked beneath the pixel area, calculates depth, confidence, and intensity maps at high speeds, using laser-modulated exposures. With enhanced NIR response at 850 nm and 940 nm wavelengths, the LIPSedge™ T235 can capture greater distances in diverse environments.
Offering superior performance in low-light and ambient light conditions, the sensor ensures low noise and delivers highly detailed point clouds and precise depth information. This breakthrough technology will significantly enhance the perception capabilities of a wide range of industrial, commercial, and consumer applications that leverage 3D depth vision.
The LIPSedge™ T235 is ideal for industries such as Smart Factories, Industrial Warehouses, Healthcare Facilities, and Retail. Experience it firsthand at the Embedded World 2025 exhibition in Nuremberg, Germany, and discover how our technology is transforming these sectors.
“LIPS Corporation is a leader in Spatial Intelligence, and the perfect partner to leverage the numerous enhancements our Hyperlux ID family has brought to the iToF technology” said Stephen Harris, Sr. Director of Marketing for the Industrial and Commercial Sensing Division at onsemi. “The combination of their impressive LIPSEdge T235 series and our Hyperlux ID’s depth sensor family’s precision accuracy at longer distances with fast moving objects results in major iToF depth advancements in Industrial, Logistics, Commercial and Retail Industries.”
For this cooperation, LIPS Corporation exhibits at Embedded World 2025, at Hall 5, Booth #5-421a, and onsemi’s booth at Hall 4A, Booth #4A-260.
To find out more, please visit LIPS® website at www.lips-hci.com
And contact directly for questions and inquiries to info@lips-hci.com