Advancing a New Embedded Architecture for Robotic Perception, Smart Dimensioning, and Human–Machine Interaction
March 10–12, 2026, Nuremberg, Germany — LIPS will present its comprehensive portfolio of 3D machine vision and AI edge computing solutions at Embedded World 2026 (Hall 5, Booth 5-380). LIPS will also participate in the Taiwan Excellence Pavilion (Hall 2, Booth 2-313), featuring the 2026 Taiwan Excellence Award-winning product, LIPSense™ 3D Body Pose SDK v7.
The showcase focuses on embedded systems and robotics applications, demonstrating a complete integration architecture spanning 3D depth machine vision products, AI sensing software, and edge computing platforms through live demonstrations.
Under the theme “Full-Stack 3D Machine Vision for Embedded & Robotics,” LIPS highlights modular design, low-latency processing, and high-stability deployment capabilities, helping industries accelerate the implementation of practical and scalable 3D perception solutions.
LIPSedge™: Next-Generation 3D Depth Machine Vision Products
LIPSedge™ is LIPS’ 3D depth machine vision product line, providing 3D camera hardware and a complete SDK ecosystem. The lineup includes three core technologies: TOF, Active Stereo, and Structured Light.
LIPSedge™ T235 — High-Precision TOF Sensing Solution
Built on a VGA TOF depth architecture, the T235 integrates 5MP RGB and onboard FPGA-based TOF decoding. Featuring Global Shutter and robust environmental adaptability, it is designed for smart manufacturing, gesture recognition, and automation applications.
- Depth accuracy ≤ 1%
- 5MP RGB synchronous output
- Onboard FPGA low-latency TOF decoding
- Global Shutter high-speed depth capture
- Supports LIPSedge™ SDK and integration with mainstream industrial frameworks
LIPSedge™ S315 — Edge AI Active Stereo Solution for Dynamic Applications
Based on Active Stereo architecture, the S315 integrates a built-in 6-axis IMU and supports edge AI system integration. It is ideal for robotics and mobile device scenarios.
- Depth accuracy ≤ 2%
- Built-in 6-axis IMU
- 720p RGB-Depth
- Global Shutter
- Compact & slim USB design
LIPSedge™ L215u — Short-Range High-Precision Structured Light Solution
Designed for short-range, high-precision 3D measurement, the L215u is optimized for industrial dimensioning, precision manufacturing, and 3D scanning.
- Accuracy 0.3% @100cm
- Global Shutter high-speed depth capture
- 940nm VCSEL active illumination
- Compact module design
- Supports LIPSedge™ SDK and industrial framework integration
LIPSolution™ Robotic Automation Solutions
LIPSolution™ delivers integrated 3D vision and AI-driven automation solutions, enabling precise navigation, object detection, and motion planning for mobile robots without relying on LiDAR.
LIPSAMR™ Perception Development Kit
LIPSAMR™ is a LiDAR-free 3D perception development platform integrated with NVIDIA Isaac ROS and Jetson edge AI architecture. Designed specifically for AMR applications, it provides real-time mapping and autonomous navigation capabilities.
- LiDAR-free high-precision navigation (4–6m sensing range @ 0.7m/s)
- Supports ROS 2 and NVIDIA Isaac ROS
- VSLAM visual localization and mapping
- Dynamic relocalization
- 1-Cam / 4-Cam configuration options
- Modular design for flexible system integration and deployment
LIPSMetric™ Smart Dimensioning Solutions
LIPSMetric™ combines 3D depth machine vision with AI algorithms to deliver real-time dimension recognition and seamless system integration.
LIPSMetric™ Vehicle Dimensioner VD115
Designed for parking and traffic management environments, the VD115 measures vehicle length, width, and height within one second, supporting automated access control and fee management integration.
- Measurement time: 1 second
- Accuracy: ±2%
- Supports vehicles up to 6 meters in length
- Integrates with parking and traffic management systems
LIPSense™ 3D Body Pose SDK v7 — Real-Time Multi-Person Skeleton Tracking
LIPSense™ 3D Body Pose SDK v7 enables multi-person body and hand joint tracking for applications including industrial safety monitoring, sports science, rehabilitation therapy, people flow analysis, human–machine interaction, and intelligent analytics.
- Tracks up to 43 people simultaneously
- Detects up to 72 keypoints
- Supports embedded computing platforms
- Low-latency 3D pose inference with high stability
LIPSView™ 3D Display Solution — Glasses-Free 3D Visualization
LIPSView™ is an integrated glasses-free 3D display platform combining 3D content capture, real-time image processing, and multi-view lenticular display technology, enabling a complete workflow from content generation to immersive visualization.
- Real-time 3D content generation
- Eye-tracking-based viewpoint correction
- Multi-view lenticular 3D display technology
- Applications across education, industrial design, entertainment, and retail
Taiwan Excellence Pavilion Showcase
In addition to the main booth, LIPS will present representative technologies at the Taiwan Excellence Pavilion, highlighting Taiwan’s innovation in 3D machine vision and edge AI.
LIPSense™ 3D Body Pose SDK v7
Winner of the 2026 Taiwan Excellence Award, this solution demonstrates advanced AI-based skeleton tracking and multi-platform integration capabilities. Live demonstrations will showcase multi-person 3D pose tracking for industrial safety, sports science, and intelligent analytics applications.
LIPSMetric™ HA115a-MH Handheld Dimensioning Device
Designed for logistics and warehousing environments, the HA115a-MH provides portable 3D dimension measurement, supporting cubic and irregular objects. AI algorithms automatically detect ground planes and object contours without pre-calibration.
- Best accuracy ±1cm (under specific conditions)
- Supports cubic and irregular object measurement
- Measures metallic and reflective packaging surfaces
- Supports RESTful API integration
Event Information
Embedded World 2026
Date: March 10–12, 2026
Location: NürnbergMesse, Nuremberg, Germany
LIPS Main Booth: Hall 5, Booth 5-380
Taiwan Excellence Pavilion: Hall 2, Booth 2-313
LIPS warmly welcomes AI and edge computing developers, robotics innovators, and system integration partners to visit and experience the real-world applications of next-generation 3D machine vision and edge AI technologies.