Are you looking to tap into the booming 3D Time-of-Flight (ToF) sensor market? Look no further than LIPS Corporation, the global leading 3D ToF solution provider. With a projected CAGR of 20.0%, the 3D ToF sensor market is expected to soar from USD 2.8 billion in 2020 to USD 6.9 billion by 2025. To make the most of this growth opportunity, partnering with LIPS can give your business the competitive edge it needs.
Hardware and Software Solutions
LIPS provides a range of hardware and software solutions for every tier of 3D ToF development, including:
3D ToF-related IP for use in FPGA or ASIC development
3D ToF module design and calibration service
3D ToF depth library/SDK/application development
Our services are designed to help you develop and deliver innovative 3D ToF products that meet the needs of your customers.
3D ToF Related IP
Our 3D ToF related IP is specifically designed for use in FPGA or ASIC development. This IP is available for licensing and can be customized to meet your specific needs. By leveraging our 3D ToF IP, you can accelerate your time-to-market and reduce your development costs.
3D ToF Module Design and Calibration Service
At LIPS, we offer complete 3D ToF module design and calibration services. Our team of experts can help you design and develop custom 3D ToF modules that meet your specific requirements. We can also provide calibration services to ensure that your modules deliver accurate and reliable performance.
3D ToF Depth Library/SDK/Application Development
Our 3D ToF depth library, SDK, and application development services can help you develop a wide range of 3D ToF applications. From gaming and virtual reality to gesture recognition and robotics, we can help you develop innovative products that leverage the power of 3D ToF technology.